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Henkel_Emersoncuming Products:
Thermal Conductive Potting,Encapsultion; 2850FT;
UV Conformal Coating: UV7993;
RFID ACA Conductive Adhesive: CE3126
Die-attach Conductive Adhesive:
|
Product |
Description |
Dispense Method |
Viscosity
(cps) |
|
Die and Component Attach |
|
84-1LMI NB |
High purity, die attach adhesive |
Screen or
Stencil |
60,000 |
|
84-1LMIT1 |
Low viscosity, high thermal conductivity, excellent adhesion to gold |
Syringe |
22,000 |
|
8700E |
High temperature resistant, high strength, excellent adhesion to gold |
Screen or
Stencil |
19,000 |
|
967-1 |
Low temperature cure |
Screen or
Syringe |
14,000 |
|
976-1 |
Flexible, low viscosity |
Screen or
Syringe |
9,000 |
|
XCE 3050 |
Microelectronic grade, stress absorbing |
Screen or
Stencil |
61,000 |
|
XCE 3051 |
Microelectronic grade, superior dispense performance (mil spec version available) |
Screen or
Syringe |
30,000 |
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