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| 爱博斯迪科 & 爱玛森康明 导电胶--介绍 |
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汉高乐泰_爱玛森康明 导电胶
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Product |
Description |
Dispense Method |
Viscosity
(cps) |
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Die and Component Attach |
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84-1LMI NB |
High purity, die attach adhesive |
Screen or
Stencil |
60,000 |
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84-1LMIT1 |
Low viscosity, high thermal conductivity, excellent adhesion to gold |
Syringe |
22,000 |
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8700E |
High temperature resistant, high strength, excellent adhesion to gold |
Screen or
Stencil |
19,000 |
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967-1 |
Low temperature cure |
Screen or
Syringe |
14,000 |
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976-1 |
Flexible, low viscosity |
Screen or
Syringe |
9,000 |
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XCE 3050 |
Microelectronic grade, stress absorbing |
Screen or
Stencil |
61,000 |
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XCE 3051 |
Microelectronic grade, superior dispense performance (mil spec version available) |
Screen or
Syringe |
30,000 |
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